Previous Events

  • AEEC, Software Distribution and Loading (SDL) Subcommittee
    Jan 05, 2022
    Virtual Meeting

    The SDL Subcommittee’s objective is to develop standards for software distribution and loading. This includes continued development of high-speed data loaders, high-density storage media, and loading protocols. The SDL Subcommittee prepares and updates standards for file format, media type, part numbering, distribution, and terminology.

    This subcommittee also defines the interfaces between the software data loader and the target hardware. The SDL Subcommittee sets standard formats for Loadable Software Parts (LSPs) so that all the requirements of configuration management of LSPs may be accomplished. 

  • AEEC, Electronic Flight Bag (EFB) Subcommittee
    Jan 12 - 14, 2022
    Virtual Meeting

    The EFB Subcommittee develops ARINC Standards that enable standardized EFB installation, connectivity, and interoperability on all types of aircraft. The standards are comprised of both hardware and software specifications and apply to interfaces, wiring and connectors, protocols, and application control.

  • AEEC, Fiber Optics Subcommittee (FOS)
    Jan 13, 2022
    Virtual Meeting

    The Fiber Optics Subcommittee (FOS) will meet to continue the development of ARINC Fiber Optic Standards used in air transport aircraft and other aircraft with similar requirements. The subcommittee’s current work projects include developing a high-density fiber interface for new aircraft cabin and avionics systems.

    This project is intended for future aircraft programs as well as the retrofit of existing airframes. Applications for this technology include avionics, in-flight entertainment systems, and other uses.

  • AEEC, Network Infrastructure and Security (NIS) Subcommittee
    Jan 18 - 20, 2022
    Virtual Meeting

    The goal of this activity is to develop standards for IP connectivity and security to the aircraft that enables fleet-wide solutions based on open standards. The expected benefit is lower development cost, increased flexibility, higher reliability, reduced complexity, longer lifespan, and ease of configurability and maintenance.